Wet Processing

NNF Staff Contact : Jeff Hagler

Standard Processes

Samples for Most Process Tanks : Pieces – 6″ Wafers

RCA SC1/SC2 : Heated Process at 75C

BOE Oxide Etch 10:1 w/o surfactant

Photo Strip

Acid Solution : Nanostrip

Solent Solution : NMP Room Temp or Heated Process

Nitride Etch : Heated Process at 180C

Al Etch : Room Temp or Heated Process up to 60C

Ti Etch (HF Based Solution)

Poly Etch

Deglaze Process (HF Based Solution)

KOH Silicon Etch (40% Concentration) : Heated Process at 80C

Piranah Solution : Room Temperature Solution Only

Stocked Chemicals

Acids

Hydrochloric Acid HCl

Buffered Oxide Etch BOE 10:1

Hydrofluoric Acid HF 49%

Acetic Acid, Glacial CH₃COOH

Sulfuric Acid 96% H₂SO₄

Nitric Acid HNO₃

BD Etchant – Transene Co

Aluminum Etch Type A – Transene Co

Transetch N – Transene Co

Titanium Etchant TFT – Transene Co

Nanostrip – Cyantek

Base/Caustics

Ammonium Fluoride 40% NH₄F

Hydrogen Peroxide 30% H₂O₂

Ammonium Hydroxide 29% NH₄OH

Solvents

NMP CH₃N(CH₂)₃CO

Acetone

Isopropyl Alcohol

Methanol

Photolithography Chemicals

Hexamethyldisilazane (HMDS)

LOR 3A

PMMA

SPR1813

SPR220 (3.0)

SPR955 (0.9)

5510

SU-8 2002

MF319

CD-26 (MF300 Equivalent)

PGMEA

MIBK:IPA

SU8 Developer