Plasma Etching

NNF Staff Contacts : Marcio Cerullo and Jeff Ricker Hagler

Oxford NGP80 RIE

Gases: CF4, CHF3, C2F6, SF6, Ar, O2

Standard Etches : SiO2, Si3N4, Glass, Si, and SiC

Samples : 1 – 4″ Wafer or Equivalent Area

Allowed Masking Materials: Photoresists and SU8

 

Alcatel Deep Reactive Ion Etch

Gases : SF6, C4F8, CF4, Ar, O2

Standard Etches : Si, Glass, SiO2

Samples : 1 – 6″ Wafer or Equivalent Area

Allowed Masking Materials : Photoresist, SU8, and Nickel

 

Oxford Chlorine Etcher

Gases : BCl3, Cl2, SF6, O2, Ar, N2

Standard Etches : GaN, AlGaN

Samples : 1 – 6″ Wafer or Equivalent Area

Allowed Masking Materials : Photoresist and SU8

 

Semigroup

Gases : CHF3, SF6, Ar, O2

Standard Etches : SiO2, Si3N4, Poly-Si, SiC

Samples : 1 – 6″ Wafer or Equivalent Area

Allowed Masking Material : Photoresist, SU8, and Metals

Trion Etcher

Gases : BCl3, Cl2, CF4, O2, Ar, N2

Standard Etches : GaAs, GaN, Poly-Si, Al

Samples : 1 – 4″ Wafer or Equivalent Area

Allowed Masking Material : Photoresist and SU8