Physical Vapor Deposition
Thermionics E-beam
Staff Contact: Geza Dezsi
Location: 125 Lab
Samples : 7 – 4″ Wafers or Equivalent Area
Approved Materials: Ti, Cr, Al, Ni, Cu, Au
2.2cc crucibles, 8 pocket rotary holder
Base Pressure ~ 2e-7 Torr; Pump Time ~ 15 minutes to low e-6 Torr
CHA E-beam MK. 40
Staff Contact: Jaime Rumsey
Location: High Bay (233)
Samples : 12 – 4″ Wafers or Equivalent Area
Approved Materials : Al, Ni, Ti, Au, Pt, Pd
Automatic operation, 6 pocket rotary holder
CHA E-beam MK. 50
Staff Contact: Jaime Rumsey
Location: Metals Bay (240C)
Sample Sizes: 4 – 6″ wafers or equivalent area
Available Targets: Ti, Cr, W, Al, Cu, Au, and Pt
Base Pressure ~ 1.2e-6 Torr; Pump Time ~ 3 Hours
Operation Gas Flow ~ 50mT Argon
DC Sputter
Staff Contact: Bill Kiether
Location: 125 Lab
Sample Sizes: 4 – 6″ wafers or equivalent area
Available Targets: Ti, Cr, W, Al, Cu, Au, and Pt
Base Pressure ~ 1.2e-6 Torr; Pump Time ~ 3 Hours
Operation Gas Flow ~ 50mT Argon
Orion Sputter Tool
Staff Contact: Bill Kiether
Location: Metals Bay (240C)
Samples : 1 – 6″ Wafer or Equivalent Area
Approved Materials: Ti, Ni, Mo
Chamber guns: 5, 2″ guns
Gas Type: Ar
Submicron thin film physical vapor deposition