Physical Vapor Deposition
Thermionics Ebeam Evaporation – Staff Contact Nicole Hedges
Samples : 7 – 4″ Wafers or Equivalent Area
Approved Materials: Ti, Cr, Al, Ni, Cu, Au
2.2cc crucibles, 8 pocket rotary holder
Base Pressure ~ 2e-7 Torr; Pump Time ~ 15 minutes to low e-6 Torr
Metal Deposition Accuracy Checks:
The deposition accuracy of titanium is checked on a monthly basis. Other supported materials are checked quarterly.
100nm of material will be deposited on a single 5″ silicon wafer over the central holder location. The actual deposition thickness will be checked on the Dektak D150 in 4 locations on the wafer and averaged. Accuracy checks will be run until final deposited thickness is within +/- 5% of the target.
Accuracy Check Data can be found here.
CHA Ebeam – Staff Contact Nicole Hedges
Samples : 12 – 4″ Wafers or Equivalent Area
Approved Materials : Al, Ni, Ti, Au, Pt, Pd
Automatic operation, 6 pocket rotary holder
DC Sputter – Staff Contact Bill Kiether
Sample Sizes: 4 – 6″ wafers or equivalent area
Available Targets: Ti, Cr, W, Al, Cu, Au, and Pt
Base Pressure ~ 1.2e-6 Torr; Pump Time ~ 3 Hours
Operation Gas Flow ~ 50mT Argon
Glovebox Resistive Heated Evaporator – Staff Contact Nicole Hedges
Samples : 1 – 6″ Wafer or Equivalent Area
Approved Materials: Al, Ti, Ni, Mg, LiF
Available Boat : Tungsten
Base Pressure ~ Barr
Orion Sputter Tool – Staff Contact Bill Kiether
Samples : 1 – 6″ Wafer or Equivalent Area
Approved Materials: Ti, Ni, Mo
Chamber guns: 5, 2″ guns
Gas Type: Ar
Submicron thin film physical vapor deposition